Two-Port SRAM Structure

ABSTRACT

An integrated circuit structure includes a Static Random Access Memory (SRAM) cell, which includes a read port and a write port. The write port includes a first pull-up Metal-Oxide Semiconductor (MOS) device and a second pull-up MOS device, and a first pull-down MOS device and a second pull-down MOS device forming cross-latched inverters with the first pull-up MOS device and the second pull-up MOS device. The integrated circuit structure further includes a first metal layer, with a bit-line, a CVdd line, and a first CVss line in the first metal layer, a second metal layer over the first metal layer, and a third metal layer over the second metal layer. A write word-line is in the second metal layer. A read word-line is in the third metal layer.

PRIORITY CLAIM AND CROSS-REFERENCE

This application is a continuation of application Ser. No. 15/089,947,entitled “Two-Port SRAM Structure,” and filed Apr. 4, 2016, which claimsthe benefit of the following provisionally filed U.S. Patentapplication: Application No. 62/288,789, entitled “Two-Port SRAMStructure,” and filed Jan. 29, 2016, which applications are herebyincorporated herein by reference.

BACKGROUND

Static Random Access Memory (SRAM) is commonly used in integratedcircuits. SRAM cells have the advantageous feature of holding datawithout a need for refreshing. With the increasing demanding requirementto the speed of integrated circuits, the read speed and write speed ofSRAM cells also become more important. With the increasinglydown-scaling of the already very small SRAM cells, however, such requestis difficult to achieve. For example, the sheet resistance of metallines, which form the word-lines and bit-lines of SRAM cells, becomesincreasingly higher, and hence the RC delay of the lines and bit-linesof SRAM cells is increased, preventing the improvement in the read speedand write speed.

When entering into nanometer era, split-word-line SRAM cells have becomeincreasingly popular due to their lithography-friendly layout shapes ofactive regions, polysilicon lines, and metal layers, and also due toshorter bit-lines for speed improvement. However, in the nanometer era,SRAM cells are also larger, resulting in two problems. Firstly, eachbit-line has to be connected to more rows of SRAM cells, which induceshigher bit-line metal coupling capacitance, and hence the differentialspeed of the differential bit-lines (bit-line and bit-line-bar) isreduced. Secondly, each word-line also has to be connected to morecolumns of SRAM cells, resulting in longer word-lines and hence worsenedresistance.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It isnoted that, in accordance with the standard practice in the industry,various features are not drawn to scale. In fact, the dimensions of thevarious features may be arbitrarily increased or reduced for clarity ofdiscussion.

FIG. 1 illustrates a circuit diagram of a two-port eight-transistor (8T)Static Random Access Memory (SRAM) cell in accordance with someembodiments.

FIG. 2 illustrates a cross-sectional view of the layers involved in anSRAM cell in accordance with some embodiments.

FIG. 3 illustrates a layout of front-end features of a two-port 8T SRAMcell in accordance with some embodiments.

FIG. 4 illustrates a read word-line and a write word-line in an SRAMcell in accordance with some embodiments.

FIG. 5 illustrates a read word-line and a write word-line having a jogin an SRAM cell in accordance with some embodiments.

FIG. 6 illustrates mini-arrays in an SRAM array and the respectiveword-lines and CVss lines in accordance with some embodiments.

FIGS. 7 through 9 illustrate the layouts of metal lines of an SRAM cellin accordance with some embodiments.

FIG. 10 illustrates a circuit diagram of a two-port ten-transistor (10T)SRAM cell in accordance with some embodiments.

FIG. 11 illustrates a layout of the front-end features of a two-port 10TSRAM cell in accordance with some embodiments.

FIGS. 12 and 13 illustrate the layouts of metal lines of an SRAM cell inaccordance with some embodiments.

FIG. 14 illustrates the schematic view of the connection of CVss powermesh inside and outside of an SRAM array in accordance with someembodiments.

FIG. 15 illustrates the schematic view of the connection of bit-lines ofan SRAM array in accordance with some embodiments.

DETAILED DESCRIPTION

The following disclosure provides many different embodiments, orexamples, for implementing different features of the invention. Specificexamples of components and arrangements are described below to simplifythe present disclosure. These are, of course, merely examples and arenot intended to be limiting. For example, the formation of a firstfeature over or on a second feature in the description that follows mayinclude embodiments in which the first and second features are formed indirect contact, and may also include embodiments in which additionalfeatures may be formed between the first and second features, such thatthe first and second features may not be in direct contact. In addition,the present disclosure may repeat reference numerals and/or letters inthe various examples. This repetition is for the purpose of simplicityand clarity and does not in itself dictate a relationship between thevarious embodiments and/or configurations discussed.

Further, spatially relative terms, such as “underlying,” “below,”“lower,” “overlying,” “upper” and the like, may be used herein for easeof description to describe one element or feature's relationship toanother element(s) or feature(s) as illustrated in the figures. Thespatially relative terms are intended to encompass differentorientations of the device in use or operation in addition to theorientation depicted in the figures. The apparatus may be otherwiseoriented (rotated 90 degrees or at other orientations) and the spatiallyrelative descriptors used herein may likewise be interpretedaccordingly.

A two-port Static Random Access Memory (SRAM) cell and the correspondinglayout of metal lines in the SRAM cell are provided in accordance withvarious exemplary embodiments. Some variations of some embodiments arediscussed. Throughout the various views and illustrative embodiments,like reference numbers are used to designate like elements.

FIG. 1 illustrates a circuit diagram of a two-port eight-transistor (8T)SRAM cell 10 in accordance with some embodiments. SRAM cell 10 includesa read port and a write port. The read port includes pull-up transistorsPU-1 and PU-2, which are P-type Metal-Oxide-Semiconductor (PMOS)transistors, and pull-down transistors PD-1 and PD-2 and pass-gatetransistors PG-1 and PG-2, which are N-type Metal-Oxide-Semiconductor(NMOS) transistors. The gates of pass-gate transistors PG-1 and PG-2 arecontrolled by write word-line W-WL that determines whether SRAM cell 10is selected for writing into or not. A latch formed of pull-uptransistors PU-1 and PU-2 and pull-down transistors PD-1 and PD-2 storesa bit, wherein the complementary values of the bit are stored in StorageData (SD) node 110 and SD node 112. The stored bit can be written intoSRAM cell 10 through complementary bit-lines including write bit-lineW-BL and write bit-line-bar W-BLB. SRAM cell 10 is powered through apositive power supply node Vdd that has a positive power supply voltage(also denoted as VDD). SRAM cell 10 is also connected to power supplyvoltage Vss (also denoted as VSS), which may be an electrical ground.Transistors PU-1 and PD-1 form a first inverter. Transistors PU-2 andPD-2 form a second inverter. The input of the first inverter isconnected to transistor PG-1 and the output of the second inverter. Theoutput of the first inverter is connected to transistor PG-2 and theinput of the second inverter.

The sources of pull-up transistors PU-1 and PU-2 are connected to CVddnode 102 and CVdd node 104, respectively, which are further connected topower supply voltage (and line) Vdd. The sources of pull-downtransistors PD-1 and PD-2 are connected to CVss node 106 and CVss node108, respectively, which are further connected to power supplyvoltage/line Vss. The gates of transistors PU-1 and PD-1 are connectedto the drains of transistors PU-2 and PD-2, which form a connection nodethat is referred to as SD node 110. The gates of transistors PU-2 andPD-2 are connected to the drains of transistors PU-1 and PD-1, whichconnection node is referred to as SD node 112. A source/drain region ofpass-gate transistor PG-1 is connected to write W-BL at a BL node. Asource/drain region of pass-gate transistor PG-2 is connected toword-line W-BLB at a W-BLB node.

SRAM cell 10 further includes a read port, which includes read pull-downtransistor RPD and read pass-gate transistor RPG connected in series.The gate of transistor RPD is connected to SD node 112. The gate oftransistor RPG is connected to read word-line (R-WL). A source/drainregion of transistor RPG is connected to read bit-line R-BL, which isconnected to a local sensing circuit (FIG. 6). A source/drain region oftransistor RPD is connected to CVss.

FIG. 2 illustrates a schematic cross-sectional view of a plurality oflayers involved in SRAM cell 10, which layers are formed on asemiconductor chip or wafer. It is noted that FIG. 2 is schematicallyillustrated to show various levels of interconnect structure andtransistors, and may not reflect the actual cross-sectional view of SRAMcell 10. The interconnect structure includes a contact level, an OD(wherein the term “OD” represents “active region”) level, via levelsVia_0 level, Via_1 level, Via_2 level, and Via_3 level, and metal-layerlevels M1 level, M2 level, M3 level, and M4 level. Each of theillustrated levels includes one or more dielectric layers and theconductive features formed therein. The conductive features that are atthe same level may have top surfaces substantially level to each other,bottom surfaces substantially level to each other, and may be formedsimultaneously. The contact level may include gate contacts (alsoreferred to as contact plugs) for connecting gate electrodes oftransistors (such as the illustrated exemplary transistors PU-1 andPU-2) to an overlying level such as the Via_0 level, and source/draincontacts (marked as “contact”) for connecting the source/drain regionsof transistors to the overlying level.

FIG. 3 illustrates a layout of the front-end features of a two-porteight-transistor (8T) SRAM cell 10 in accordance with exemplaryembodiments. The front-end features include the features in the Via_0level (FIG. 1) and the features underlying the Via_0 level. The outerboundaries 10A, 10B, 10C, and 10D of SRAM cell 10 are illustrated usingdashed lines, which mark a rectangular region. SRAM cell 10 has lengthL1 measured in the X direction (row direction), and width W1 measured inthe Y direction (column direction). In accordance with some embodimentsof the present disclosure, ratio L1/W1 is greater than about 3.5, andhence SRAM cell 10 is elongated in the row direction.

Dashed line 10E is illustrated to show where the read port is joined tothe write port. An n_well region is at the middle of the write port ofSRAM cell 10, and two p_well regions are on opposite sides of the n_wellregion. CVdd node 102, CVdd node 104, CVss node 106, CVss node 108, thewrite bit-line (W-BL) node, and the write bit-line-bar (W-BLB) node,which are shown in FIG. 1, are also illustrated in FIG. 3.

In the write port, gate electrode 16 forms pull-up transistor PU-1 withthe underlying active region (in the n-well region) 20, which may befin-based, and hence are referred to fin 20 hereinafter. Gate electrode16 further forms pull-down transistor PD-1 with the underlying activeregions (in the first p_well region on the left side of the n-wellregion) 14, which may be fin-based. Gate electrode 18 forms pass-gatetransistor PG-1 with the underlying active regions 14. Gate electrode 36forms pull-up transistor PU-2 with the underlying active region (in then_well region) 40. Gate electrode 36 further forms pull-down transistorPD-2 with the underlying active region (in the second p_well region onthe right side of the n_well region) 34. Gate electrode 38 formspass-gate transistor PG-2 with the underlying active region 34. Inaccordance with some embodiments of the present disclosure, pass-gatetransistors PG-1 and PG-2, pull-up transistors PU-1 and PU-2, andpull-down transistors PD-1 and PD-2 are Fin Field-Effect Transistors(FinFETs). In accordance with alternative embodiments of the presentdisclosure, pass-gate transistors PG-1 and PG-2, pull-up transistorsPU-1 and PU-2, and pull-down transistors PD-1 and PD-2 are planar MOSdevices.

In the read port, gate electrode 36 extends farther to form readpull-down transistor RPD with the underlying active regions 49, whichare semiconductor fins in accordance with some embodiments. Gateelectrode 51 forms read pass-gate transistor RPG with the underlyingactive regions 49 also.

FIG. 3 illustrates two fins 14 (and two fins 34 and two fins 49) inaccordance with some embodiments. In accordance with other embodiments,there may be a single fin, two fins, three fins, or more for forming thetransistors.

As shown in FIG. 3, SD node 110 includes source/drain contact plug 42and gate contact plug 44, which are the features at the contact level(FIG. 2). Contact plug 42 is elongated and has a longitudinal directionin the X direction, which is parallel to the extending directions ofgate electrodes 16 and 36. Gate contact plug 44 comprises a portionover, and is electrically connected to, gate electrode 36. In accordancewith some embodiments of the present disclosure, gate contact plug 44has a longitudinal direction in the Y direction, with is perpendicularto the X direction. At the Manufacturing of the SRAM cell 10 on physicalsemiconductor wafers, contact plugs 42 and 44 may be formed as a singlecontinuous butted contact plug.

SD node 112 includes source/drain contact plug 46 and gate contact plug48. Gate contact plug 48 has a portion overlapping source/drain contactplug 46. Since SD node 110 may be symmetric to SD node 112, the detailsof gate contact plug 48 and source/drain contact plug 46 are notrepeated herein, and may be found referring to the discussion of gatecontact plug 44 and source/drain contact plug 42, respectively.

FIG. 3 also illustrates write word-line contacts (marked as W-WLcontacts) connected to gate electrodes 18 and 38. Throughout thefigures, each of contacts (also referred to as contact plugs) isillustrated using a mark including a rectangle with a “x” sign therein.Furthermore, a plurality of vias, each illustrated using a circle and a“x” sign in the circle, is over and contacting the respective underlyingcontact plugs. Elongated contact plugs 54A and 54B are used to connectthe source regions of pull-down transistors PD-1 and PD-2, respectively,to CVss lines. Elongated contact plugs 54A and 54B are parts of the CVssnodes 106 and 108, respectively. Elongated contact plugs 54A and 54Bhave lengthwise directions parallel to the X direction, and may beformed to overlap the corners of SRAM cell 10. Furthermore, elongatedcontact plugs 54A and 54B may further extend into neighboring SRAM cellsthat abut SRAM cell 10.

Elongated contact plug 54B extends into both the read port and the writeport. Elongated contact plug 54B is connected to a CVss line(s) at theM1 level through either via_0 level via 53A, via_0 level via 53B, orboth. Accordingly, vias 53A and 53B are illustrated as being dashed toshow one of them may or may not be omitted. There is also a plurality offeatures such as R-WL contact. The functions of these features and thecorresponding vias and contact plugs may be found from FIG. 3, and henceare not discussed.

FIG. 4 illustrates the metal lines formed at the M1 level, M2 level, M3level, and M4 level of SRAM cell 10. Throughout the description, thenotations of metal lines may be followed by the metal levels they arein, wherein the respective metal level is placed in parenthesis. Asshown in FIG. 4, a first 1^(st) CVdd line, a 1^(st), a second (2^(nd)),and a third (3^(rd)) CVss lines, write bit-line W-BL, write bit-line-barW-BLB, and read bit-line R-BL (also refer to FIG. 1) are disposed at theM1 level (FIG. 2), and have lengthwise directions parallel to the Ydirection (column direction). Accordingly, each of these metal lines mayextend into, and may be connected to, a plurality of SRAM cells in thesame column. Either one or both of the 2^(nd) and 3^(rd) CVss lines maybe formed, and hence the 2^(nd) and 3^(rd) CVss lines are marked usingdashed lines. Correspondingly, either one or both of the Via_0 levelvias 53A or 53B may be formed in order to connect to the respectiveoverlying 2^(nd) CVss line and 3^(rd) CVss line.

Since local sensing is used to measure the signals on read bit-lineR-BL, read bit-line R-BL is often very short (for example, R-BL may be16 times or 32 times the width of a SRAM cell 10 in the Y direction). Onthe other hand, write bit-line W-BL is a global bit-line, and may have alength equal to, for example, 256 times the width of a SRAM cell 10 (inthe Y direction). Accordingly, the resistance of write bit-line W-BL ismore critical than read bit-line R-BL, and width W5 of line W-BL may begreater than line width W6 of read bit-line R-BL to reduce its lineresistance. Ratio W5/W6 may be greater than about 1.2 in accordance withsome embodiments.

Write word-line W-WL and read word-line R-WL are disposed in differentmetal layers so that their widths may be maximized in order to reducethe resistance. In accordance with some embodiments of the presentdisclosure, write word-line W-WL is at the M2 level (FIG. 2), and readword-line R-WL is at the M4 level. In accordance with some embodiments,at the M4 level and inside SRAM cell 10, there is a single R-WL withoutany other metal line. In accordance with some embodiments, the ratioW3/W4, which is the ratio of width W3 of R-WL to width W4 of W-WL isgreater than about 1.5. Disposing read word-line R-WL in a higher metallayer and having a greater width than write bit-line W-WL isadvantageous for improving the speed of SRAM cell 10 since readoperations are performed more than write operations, and hence the readspeed is more critical than the write speed.

Since write word-line W-WL is long, to reduce the resistance of W-WL,the thickness of the M2 level, in which W-WL is located, may beincreased. For example, referring to FIG. 2, thickness T2 of the M2level (which is equal to the thickness of W-WL) is increased, and may begreater than thickness T4 of the M4 level (which is equal to thethickness of R-WL). An exemplary ratio of T2/T4 is greater than about1.3.

FIG. 5 illustrates the write word-line W-WL in accordance with someembodiments of the present disclosure. Write word-line W-WL includesstrip portion W-WL-A, which is a strip having a rectangular shapeextending all the way through SRAM cell 10. Write word-line W-WLincludes jog portion W-WL-B on one side of strip portion W-WL-A. Theformation of jog portion W-WL-B results in the advantageous increase inthe widths of write word-line W-WL, and hence the resistance of writeword-line W-WL is further reduced, resulting in an advantageousreduction of RC delay. In accordance with alternative embodiments, writeword-line W-WL includes strip portion W-WL-A and does not include jogportion W-WL-B. Accordingly, jog portion W-WL-B is illustrated usingdashed lines to indicate it may or may not exist.

FIG. 6 schematically illustrates a CVss power mesh in accordance withsome embodiments. For example, an SRAM array includes a plurality ofmini-arrays, with mini-array-1 and mini-array-2 illustrated. Eachmini-array has more than four columns and more than four rows.Mini-arrays mini-array-1 and mini-array-2 are separated from each otherby a local sensing circuit, which is used for sensing (during readoperations) the voltages on the bit-lines of the respective mini-array.The mini-arrays are connected to a write-port WL driver(s) and aread-port WL driver(s). FIG. 6 shows that global CVss lines are disposedat the M3 level, and are connected to the CVss lines (strap) at the M2level. Accordingly, the CVss power mesh is formed. The connection of theglobal CVss line to the CVss straps may be outside of the mini-array.For example, as shown in FIG. 6, the connection is located in the spacebetween mini-array-1 and mini-array-2.

FIG. 7 illustrates the layout of metal lines in accordance with someembodiments. These embodiments are similar to the embodiments shown inFIG. 4, except a first CVss power mesh line is formed at the M2 level,and is connected to a second CVss power mesh line (which may be the sameglobal CVss line in FIG. 6) at the M3 level through a Via_2 via. Thefirst CVss power mesh line is connected to the 1^(st) and the 2^(nd)CVss lines at the M1 level. It is note that although there is a namingdifference between “CVss power mesh line” and “CVss line,” both a metallines for connecting the CVss voltage and may form a power mesh, and thenotations may be used interchangeably. In the embodiments shown in FIG.7, the first CVss power mesh line is in SRAM cells, different from theCVss strap shown in FIG. 6. In accordance with some embodiments, boththe first CVss power mesh line in FIG. 7 and the CVss strap in FIG. 6are formed.

FIG. 8 illustrates the layout of metal lines in accordance with someembodiments. These embodiments are similar to the embodiments shown inFIG. 7, except the second CVss power mesh line (in M3) is formed at theboundary of SRAM 10, and hence is shared by two neighboring columns ofSRAM cells 10 in the same SRAM array.

FIG. 9 illustrates the layout of metal lines in accordance with someembodiments. These embodiments are similar to the embodiments shown inFIG. 7, except a third CVss power mesh line is formed at the M3 level.The third CVss power mesh line may be formed at the boundary of SRAMcell 10, and hence is shared by two neighboring rows of SRAM cells 10 inthe same SRAM array.

FIG. 10 illustrates a circuit diagram of a two-port ten-transistor (10T)SRAM cell 10 in accordance with some embodiments. The read port of SRAMcell 10 includes a pair of read pull-down transistors RPD-1 and RPD-2,and a pair of read pass-gate transistors RPG-1 and RPG-2. The gates oftransistors RPD-1 and RPD-2 are connected to SD nodes 110 and 112,respectively. A source/drain region of transistor RPG-1 is connected toread bit-line R-BL, and a source/drain region of transistor RPG-2 isconnected to read bit-line R-BLB, wherein bit-lines R-BL and R-BLB arecomplementary read bit-lines. The gates of transistors RPG-1 and RPG-2are connected to the same read word-line R-WL.

FIG. 11 illustrates a layout of the front-end features of a two-port 10TSRAM cell 10 in accordance with some exemplary embodiments, wherein thefront-end features include the features in the Via_0 level (FIG. 1) andthe features underlying the Via_0 level. The layout of the write portand the read port on the right side of the write port (refer to asright-side read port hereinafter) in combination are essentially thesame as what are shown in FIG. 3. The read port on the left side of thewrite port (refer to as left-side read port hereinafter) is essentiallythe same as the right-side read port, except it is on the left side ofwrite port. Again, the ratio of length L2 to width W2 of SRAM cell 10 isgreater than about 3.5 in accordance with some embodiments. The detailsof the layout may be found referring to the embodiments shown in FIG. 3,and hence is not repeated herein.

FIG. 12 illustrates the metal lines formed at the M1 level, M2 level, M3level, and M4 level of the two-port 10T SRAM cell 10. As shown in FIG.13, a first CVdd line, a 1^(st), a 2^(nd), a 3^(rd), and a fourth(4^(th)) CVss lines, read bit-lines R-BL and R-BLB, and write bit-linesW-BL and W-BLB are disposed at the M1 level (FIG. 2), and havelengthwise directions parallel to the Y direction. Either one or both ofthe 2^(nd) and 4^(th) CVss lines may be formed, and hence the 2^(nd) and4^(th) CVss lines are marked using dashed lines. Accordingly, either oneor both of the Via_0 level vias 53A or 53B may be formed in order toconnect to the respective overlying 2^(nd) and 4^(th) CVss lines. A3^(rd) CVdd line may be formed at the M3 level, and connected to the1^(st) CVdd line. The 1^(st) the 2^(nd), and the 3^(rd) power mesh linesare also illustrated, with the corresponding metal levels marked.

Similar to the embodiments as shown in FIG. 4, write word-line W-WL andread word-line R-WL are disposed in different metal layers so that theirwidths may be maximized in order to reduce the resistance. In accordancewith some embodiments of the present disclosure, write word-line W-WL isat the M2 level (FIG. 2), and read word-line R-WL is at the M4 level.Also in accordance with some embodiments, inside SRAM cell 10 and at theM4 level, there is a single R-WL without any other metal line. Inaccordance with some embodiment, the ratio W3/W4, which is the ratio ofwidth W3 of R-WL to width W4 of W-WL is greater than about 1.5.

FIG. 13 illustrates the layout of metal lines in accordance with someembodiments. These embodiments are similar to the embodiments shown inFIG. 12, except a 3^(rd) CVss power mesh line is formed at the M4 level.The 5^(th) CVss power mesh line is at the boundary of SRAM 10, and henceis shared by two neighboring columns of SRAM cells 10 in the same SRAMarray. The 1^(st) and the 2^(nd) power mesh lines are also illustrated,with the corresponding metal levels marked.

FIG. 14 schematically illustrates a CVss power mesh in accordance withsome embodiments. For example, a two-port (2P) 10T SRAM array includesthe 2^(nd) CVss power mesh lines (also refer to FIGS. 12 and 13) at theM3 level. At the locations outside of the array (such as the illustratedtop side and bottom side), the 2^(nd) CVss power mesh lines areconnected to CVss straps at the M2 level and the CVss straps at the M4level. Also, the 2^(nd) CVss power lines in M3 level may be connected tothe 1^(st) CVss power mesh lines at M2 level, which is further connectedto the CVss lines at the M1 level, wherein the M1 level CVss linesextend in the Y direction. The respective connections may be inside theSRAM array. The word-lines W-WL (M2) and R-WL (M4) of the SRAM array areconnected to a write-port WL driver and a read-port WL driver,respectively.

FIG. 15 schematically illustrates a connection scheme for bit-lines(W-BL, W-BLB, R-BL, and R-BLB) of a 2P 10T SRAM array. As shown in FIG.15, write bit-lines W-BL and W-BLB of the array are connected to senseamplifier SA-1, which may be a global sense amplifier (wherein the senseamplifier SA-1 is shared by the entire column of the array). Readbit-lines R-BL and R-BLB of the array are connected to sense amplifierSA-2, which may be a local sense amplifier (wherein the sense amplifierSA-2 is shared by some, but not all, of SRAM cells in the same column).The word-lines W-WL (M2) and R-WL (M4) of the SRAM array are connectedto a write-port WL driver and a read-port WL driver, respectively.

The embodiments of the present disclosure have some advantageousfeatures. By forming read word-line R-WL and write word-line W-WL indifferent metal lines, the widths of the word-lines may be increased,and the thickness of the write word-line may also be increased,resulting in the advantageous reduction of the resistance of both readword-line and write word-line. The formation of jogs for word-lines alsocontributes to the reduction of the resistance of the word-line. TheCVss power mesh may include portions in M1, M2, M3, and M4 levels toimprove the performance of the corresponding SRAM array.

In accordance with some embodiments of the present disclosure, anintegrated circuit structure includes a Static Random Access Memory(SRAM) cell, which includes a read port and a write port. The write portincludes a first pull-up Metal-Oxide Semiconductor (MOS) device and asecond pull-up MOS device, and a first pull-down MOS device and a secondpull-down MOS device forming cross-latched inverters with the firstpull-up MOS device and the second pull-up MOS device. The integratedcircuit structure further includes a first metal layer, with a bit-line,a CVdd line, and a first CVss line in the first metal layer. A secondmetal layer is over the first metal layer, and a third metal layer isover the second metal layer. A write word-line is in the second metallayer. A read word-line is in the third metal layer.

In accordance with some embodiments of the present disclosure, anintegrated circuit structure includes a Static Random Access Memory(SRAM) cell, which includes a read port and a write port. The write portincludes a first pull-up Metal-Oxide Semiconductor (MOS) device and asecond pull-up MOS device, and a first pull-down MOS device and a secondpull-down MOS device forming cross-latched inverters with the firstpull-up MOS device and the second pull-up MOS device. The integratedcircuit structure further includes a first metal layer, with a bit-line,a CVdd line, and a first CVss line in the first metal layer. A writeword-line is in a second metal layer over the first metal layer. Thewrite word-line includes a strip portion having a uniform width acrossthe SRAM cell, and a jog portion on a side of, and connected to, thestrip portion. A read word-line is two metal layers higher than thewrite word-line.

In accordance with some embodiments of the resent disclosure, anintegrated circuit structure includes a Static Random Access Memory(SRAM) cell, which includes a read port and a write port. The write portincludes a first pull-up Metal-Oxide Semiconductor (MOS) device and asecond pull-up MOS device, and a first pull-down MOS device and a secondpull-down MOS device forming cross-latched inverters with the firstpull-up MOS device and the second pull-up MOS device. The integratedcircuit structure further includes a first metal layer, with a bit-line,a CVdd line, and a first CVss line in the first metal layer. A secondmetal layer is over the first metal layer, with a second CVss line inthe second metal layer and extending in a second direction perpendicularto the first direction. A third metal layer is over the second metallayer, with a third CVss line in the third metal layer and extending inthe first direction. The first CVss line, the second CVss line, and thethird CVss line are electrically interconnected to form a power mesh.

The foregoing outlines features of several embodiments so that thoseskilled in the art may better understand the aspects of the presentdisclosure. Those skilled in the art should appreciate that they mayreadily use the present disclosure as a basis for designing or modifyingother processes and structures for carrying out the same purposes and/orachieving the same advantages of the embodiments introduced herein.Those skilled in the art should also realize that such equivalentconstructions do not depart from the spirit and scope of the presentdisclosure, and that they may make various changes, substitutions, andalterations herein without departing from the spirit and scope of thepresent disclosure.

What is claimed is:
 1. An integrated circuit structure comprising: aStatic Random Access Memory (SRAM) cell comprising a read port and awrite port; a first metal layer, with a bit-line, a CVdd line, and afirst CVss line in the first metal layer and in the SRAM cell; a secondmetal layer over the first metal layer, wherein a write word-line is inthe second metal layer and in the SRAM cell, and the write word-line isconnected to the write port; and a third metal layer over the secondmetal layer, wherein a read word-line is in the third metal layer and isconnected to the read port, and wherein a first width of the readword-line is greater than a second width of the write word-line.
 2. Theintegrated circuit structure of claim 1, wherein the write word-line hasa lengthwise direction, and the write word-line extends in thelengthwise direction to reach opposite boundaries of the SRAM cell, andthe write word-line comprises: a first portion having a first width; anda second portion having a second width greater than the first width,with both the first width and the second width measured in a widthwisedirection perpendicular to the lengthwise direction.
 3. The integratedcircuit structure of claim 2, wherein the first portion comprises afirst edge, and the second portion comprises a second edge, and thefirst edge and the second edge are portions of a straight edge extendingto the opposite boundaries of the SRAM cell.
 4. The integrated circuitstructure of claim 3, wherein the first portion further comprises athird edge, and the second portion further comprises a fourth edgeparallel to the third edge, and wherein the third edge and the fourthedges are parallel to, and have different distances from, the straightedge.
 5. The integrated circuit structure of claim 4 further comprisinga read word-line landing pad in the second metal layer, wherein a firstdistance from the read word-line landing pad to the first portion of thewrite word-line is smaller than a second distance between the third edgeand the fourth edge.
 6. The integrated circuit structure of claim 1,wherein an entirety of the write word-line is between two parallelboundaries of the SRAM cell.
 7. The integrated circuit structure ofclaim 1, wherein a ratio of the first width to the second width isgreater than about 1.5.
 8. The integrated circuit structure of claim 1,wherein a thickness of the write word-line is greater than a thicknessof the read word-line.
 9. The integrated circuit structure of claim 1,wherein a thickness of the second metal layer is greater than athickness of the third metal layer.
 10. The integrated circuit structureof claim 9, wherein a ratio of the second metal layer to the thicknessof the third metal layer is greater than about 1.3.
 11. An integratedcircuit structure comprising: a Static Random Access Memory (SRAM) cellcomprising: a write word-line in the SRAM cell, wherein the writeword-line comprises: a strip portion having a uniform width, wherein thestrip portion extends from a first boundary to a second boundary of theSRAM cell, with the first boundary being parallel to the secondboundary; and a jog portion on a side of the strip portion, wherein thestrip portion is physically joined to the jog portion to form acontinuous region.
 12. The integrated circuit structure of claim 11,wherein the jog portion in the SRAM cell has a first length smaller thana second length of the SRAM cell, wherein the first length and thesecond length are measured in a direction perpendicular to the firstboundary and the second boundary.
 13. The integrated circuit structureof claim 11, wherein the SRAM cell comprises a write port, and the writeword-line is electrically connected to the write port.
 14. Theintegrated circuit structure of claim 13, wherein the SRAM cell furthercomprises: a read port; and a read word-line in a different metal layerthan the write word-line.
 15. An integrated circuit structurecomprising: a Static Random Access Memory (SRAM) cell comprising a port;a word-line over and electrically connected to the port, wherein theword-line comprises: a strip portion, wherein the strip portion extendsfrom a first boundary of the SRAM cell to a second boundary of the SRAMcell, with the first boundary and the second boundary being oppositeboundaries of the SRAM cell; and a jog portion extending from the firstboundary of the SRAM cell to an intermediate position of the SRAM cell,wherein the intermediate position is spaced apart from the secondboundary of the SRAM cell.
 16. The integrated circuit structure of claim15, wherein the SRAM cell comprises a write port and a read port, andthe port is the write port, and wherein the word-line is a writeword-line.
 17. The integrated circuit structure of claim 16 furthercomprising a read word-line parallel to the write word-line, wherein theread word-line is in a metal layer higher than a metal layer of thewrite word-line.
 18. The integrated circuit structure of claim 17,wherein the read word-line is wider than the write word-line.
 19. Theintegrated circuit structure of claim 17 further comprising a readword-line landing pad in a same metal layer as the write word-line,wherein the read word-line landing pad extends to the second boundary,and is spaced apart from the first boundary.
 20. The integrated circuitstructure of claim 15, wherein the strip portion and the jog portion arejoined with each other to form a continuous region.